Shenzhen Tianweisheng Electronic Co., Ltd.
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Price: | 0.1~0.5 USD |
Payment Terms: | T/T,WU;Paypal |
Place of Origin: | Guangdong, China (Mainland) |
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NO | ITEM | Technical Data |
1 | Layer | 2-20 Layers |
2 | Board material | FR4,FR4 Halogen free,TEFLON Rogers,Getek High-TG(TG>170),Aluminium base |
3 | Max.Board Size0 | 457*660mm |
4 | Min.Board Thickness | 2 layers 0.2mm |
4 layers 0.4mm | ||
6 layers 0.8mm | ||
8 layers 1.0mm | ||
10 layers 1.2mm | ||
5 | Max.Board Thickness | 8.0mm |
6 | Min.Line Width | 0.05mm |
7 | Min.Line Space | 0.05mm |
8 | Min.Hole Size0 | Electroplating Via 0.15mm |
Micro via 0.075mm | ||
9 | PTH Wall Thickness) | 20-25um |
10 | Max.finish copper thickness0 | 8OZ |
11 | PTH Dia.Tolerance | ±0.05mm |
12 | NPTH Dia.Tolerance | ±0.025mm |
13 | Hole Position Deviation | ±0.05mm |
14 | Outline Tolerance | ±0.1mm |
15 | Min.S/M Pitch | 0.08mm |
16 | Insulation Resistance | 3x10Sec, 288°C |
17 | Warp and Twist | ≤0.7% |
18 | Electric Strength | >1.3KV/mm |
19 | Peel Strength | ≥1.4N/mm |
20 | Solder Mask Abrasion | ≥6H |
21 | Flammability | 94V0 |
22 | Impedance Control | ±5% |
We are the professional PCB (1-28 layers), FPC (1-10 layers) and Rigid-Flex (1-12 layers) manufacturer. Our all products have pass UL, CE, RHOS certification. Our company have pass ISO, SGS Authentication. Our company has a strong team, including best R&D technicians, QC technicians, and sales engineer. Our quality is guaranteed in the higher level in China and all over the world. We supply OEM & ODM, if you have idea, please send the Gerber files and fabrication requirements to us, we will reply you as soon as possible. |
sales @twspcb.com |
NO | ITEM | Technical Data |
1 | Layer | 2-20 Layers |
2 | Board material | FR4,FR4 Halogen free,TEFLON Rogers,Getek High-TG(TG>170),Aluminium base |
3 | Max.Board Size0 | 457*660mm |
4 | Min.Board Thickness | 2 layers 0.2mm |
4 layers 0.4mm | ||
6 layers 0.8mm | ||
8 layers 1.0mm | ||
10 layers 1.2mm | ||
5 | Max.Board Thickness | 8.0mm |
6 | Min.Line Width | 0.05mm |
7 | Min.Line Space | 0.05mm |
8 | Min.Hole Size0 | Electroplating Via 0.15mm |
Micro via 0.075mm | ||
9 | PTH Wall Thickness) | 20-25um |
10 | Max.finish copper thickness0 | 8OZ |
11 | PTH Dia.Tolerance | ±0.05mm |
12 | NPTH Dia.Tolerance | ±0.025mm |
13 | Hole Position Deviation | ±0.05mm |
14 | Outline Tolerance | ±0.1mm |
15 | Min.S/M Pitch | 0.08mm |
16 | Insulation Resistance | 3x10Sec, 288°C |
17 | Warp and Twist | ≤0.7% |
18 | Electric Strength | >1.3KV/mm |
19 | Peel Strength | ≥1.4N/mm |
20 | Solder Mask Abrasion | ≥6H |
21 | Flammability | 94V0 |
22 | Impedance Control | ±5% |
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