Shenzhen Tianweisheng Electronic Co., Ltd.
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Price: | 0.02~0.3 USD |
Payment Terms: | T/T,L/C,WU |
Place of Origin: | Guangdong, China (Mainland) |
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technologyproject | making ability and technologystandard |
Certificate | ISO9001,ISO14001, UL |
Surface Finishing | Plating Nickel and immersion Gold, Hot Air (HASL), HASL Lead Free,OSP, Immersion Tin |
Max.panel size | 600mm*700mm |
Min.panel size | 5mm*5mm |
Boardwarpage | single side<=1.0% double side<=0.6% multi-layer<=0.6% |
Min.Thickness | 0.2mm±0.08mm |
Min.Line width | HASL board 0.07mm±20%(2mil±20%) |
Min.line space | immersion Gold 0.075mm±20%(2mil±20%) |
copperfoil to board sidespacing | 0.5mm |
hole sideto linesidespacing | 0.3mm |
Min hole size | 0.2mm |
copper thinckness of Hole | 20-35um |
Tooling hole tolerance | ±0.076mm |
Min.stamping round hole diameter | FR-4 board thinckness 1.0mm(40mil)under 1.0mm(40mil) |
Min.stamping round hole diameter | FR-4 board thinckness1.2-3.0mm(47mil-120mil)1.5mm(59mil) |
Min.stamping square hole specification | FR-4.CEM-3 board thinckness 1.0mm(40mil) under 0.8mm x0.8mm(31.5mil x 31.5mil) |
Min.stamping square hole specification | FR-4.CEM-3 board thinckness 1.2mm - 3.0mm(47mil-120mil) 1.0mm x1.0mm(40mil x 40mil) |
tracedeviation | ±0.076mm(±3mil) |
Molding size tolerancelimit | CNC milling profile ±0.15mm(±6mil); die profile±0.15mm(±6mil) |
V-CUT registration accuracy | ±0.2mm(±8mil) |
producttype | single sidedouble side multi-layer and flexibleboard |
Base Material | FR-4,CEM-1, CEM-3, High frequency, aluminium basedboard |
processthinckness | 0.2-3.5mm |
base materialcopperthinckness | 18um, 35um, 70um, 105 um |
Min.hold diameter | 0.2mm |
platingthinckness | plating gold Ni2.5-5um, Au0.05-0.10um |
platingthinckness | immersion gold Ni5-8um, Au0.08-0.12um |
platingthinckness | finger gold Ni2.5-5um, Au0.05-0.12um |
processability | 20000 square meters/month |
profileprocess | die CNC machine |
V-CUT horntolerance | ±5° |
V-CUT board materialthinckness | 0.6mm - 3.2mm (15.5mil - 129.58mil) |
Min.SMD space | 0.3mm (12mil) |
Min.component markingfont | 0.15mm (5.79mil) |
Min. single side solder annular width(production) | 0.15mm (5.79mil) |
Min. cross-hatchingpad | 0.076mm (0.3mil) |
Min.soldermask brigde | ±0.076mm(±3mil) |
Carbonink board making data | 1)1.0 high impedance control limit:20K±10% |
2)2.0 hardness:6H | |
3)3.0 can bear friction time:over200000 |