Shenzhen Tianweisheng Electronic Co., Ltd.
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Price: | 0.1~0.5 USD |
Place of Origin: | Guangdong, China (Mainland) |
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FPC Production Capacity | |||||
ITEM | TECHNICAL PARAMETER | ||||
Layers | 1-6 Layers | ||||
Mini thickness | 0.08mm | ||||
Min.Line Width | 0.05mm | ||||
Min.Hole Size | 0.15mm PTH | ||||
Min. PTH Hole Ring | 0.45mm | ||||
Min. Gap between Cover Layer and Pad | 0.1mm | ||||
Min. Gap between Trace and Outline | 0.2mm | ||||
Trace Width Tolerance | ±0.03mm W±30% | ||||
Outline Tolerance | ±0.05mm L≤25mm | ||||
Hole Size Tolerance | ±0.05mm | ||||
Stiffener and Outline Tolerance | ±0.1mm | ||||
Surface Treatment | ENIG,Gold Plating,HAL,Plating Pb-Sn |
Description | Specification Inch (mm) | ||
Material | FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3/CEM-1/Aluminium | ||
Layer No. | 1-12 | ||
Board thickness | 0.015"(0.4mm)-0.125''(3.2mm) | ||
Board Thickness Tolerance | ±10% | ||
Cooper thickness | 1/2OZ-3OZ | ||
Impedance Control | ±10% | ||
Warpage | 0.075%-1.5% | ||
Peelable | 0.012"(0.3mm)-0.02'(0.5mm) | ||
Images | |||
Min Trace Width (a) | 0.005"(0.125mm) | ||
Min Space Width (b) | 0.005"(0.125mm) | ||
Min Annular Ring | 0.005"(0.125mm) | ||
SMD Pitch (a) | 0.012"(0.3mm) | ||
BGA Pitch (b) | 0.027"(0.675mm) | ||
Regesiter torlerance | 0.05mm | ||
Solder Mask | |||
Min Solder Mask Dam (a) | 0.005"(0.125mm) | ||
Soldermask Clearance (b) | 0.005"(0.125mm) | ||
Min SMT Pad spacing (c) | 0.004"(0.1mm | ||
Solder Mask Thickness | 0.0007"(0.018mm) | ||
Holes | |||
Hole size | 0.01"(0.25mm)-- 0.257"(6.5mm) | ||
Hole Size Tol (+/-) | ±0.003"(±0.0762mm) | ||
Aspect Ratio | 6:1 | ||
Hole Registration | 0.004"(0.1mm) | ||
Plating | |||
HASL | 2.5um | ||
Lead free HASL | 2.5um | ||
Immersion Gold | Nickel 3-7um Au:1-3u'' | ||
OSP | 0.2-0.5um | ||
Outline | |||
Panel Outline Tol (+/-) | ±0.004''(±0.1mm) | ||
Beveling | 30°45° | ||
V-cut | 15° 30° 45° 60° | ||
Certificate | ROHS ISO9001:2000 TS16949 SGS UL certificate |
Quantity | Prototype&Low Volume PCB Assembly,from 1 Board to 250,is specialty,or up to 1000 |
Type of Assembly | SMT,Thru-hole |
Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
Components | Passive Down to 0201 size BGA and VFBGA Leadless Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Repair and Reball Part Removal and Replacement |
Bare Board Size | Smallest:0.25*0.25 inches Largest:20*20 inches |
File Formate | Bill of Materials Gerber files Pick-N-Place file |
Types of Service | Turn-key,partial turn-key or consignment |
Component packaging | Cut Tape,Tube,Reels,Loose Parts |
Turn Time | Same day service to 15 days service |
Testing | Flying Probe Test,X-ray Inspection AOI Test |