electronic lcd display fpc from China manufacturer - Shenzhen Tianweisheng Electronic Co., Ltd.

Price:	0.1~0.5 USD
Place of Origin:	Guangdong, China (Mainland)


	Add to My Favorites
HiSupplier Escrow	Share \|

Product Detail

Production Capacity: 300000 Square meter/Month

Delivery Date: 5 days for pcb sample, 15 d...

Base Material: FR4/PI

Board Thickness: 2.3mm

Min. Line Width: 2mil

Surface Finishing: Gold plating

Max size of finish board: 9200*900mm

Controlled impedance: ±5%

Rang of finish boards thickness: 0.21~7.0mm

Impedance control: ±10%

PCB standard: IPC-A-610D

Packing: vacuum package+carton box

Brand Name: tws

Copper Thickness: 35um

Min. Hole Size: 0.2mm

Min. Line Spacing: 2mil

Solder mask: Green/Blue/Black/White/Yell...

Certification: UL/SGS/ROHS

Warp&Twist: 0.7%

Layer count: 1~28

OEM/ODM: One-stop service

electronic lcd display fpc
1, No MOQ;
2, OEM Service;
3, UL.ROSH SGS Certification;
4, High quality, low cost&fast delivery.

electronic lcd display fpc

We are a Manufacturer & Supplier Specializing in Double Side PCB, Multi-Layer PCB, PTFE PCB, Ceramic PCB, Rogers PCB, Aluminum PCB. Meanwhile, we provide PCBA (Assembly) and ODM, OEM service. We are specializes in a full SMT and through hole PCBA assembly, obtaining components, building prototype quantities, and testing.
We supply all kinds of flex PCB

Specifications:
1) Min. Trace width: 0.004"
2) Min. Space between trace: 0.004"
3) Min. Hole size: 0.012"
4) Thickness tolerance:
A) Single sided: 0.005"
B) Double sided: 0.010"
5) Base materials: Polyimide and polyester
6) Conductor (copper thickness): 0.5oz., 10oz. And 20oz. (RA and ED copper)
7) Cover-layer: Polyimide and polyester (solder mask printing is available)
8) Adhesive material: Epoxy, acrylic and polyester
9) Stiffener materials: FR-4, mylar and polyimide
10) Surface finishes: Flash gold plating, selective gold plating and solder plating.

PCB capacity

Item	Manufacture Capability
Material	FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based
Layer No.	1-16
Finished Board thickness	0.2 mm-3.8mm'(8 mil-150 mil)

Board Thickness Tolerance	±10%
Cooper thickness	0.5 OZ-11OZ (18 um-385 um)
Copper Plating Hole	18-40 um
Impedance Control	±10%
Warp&Twist	0.70%
Peelable	0.012"(0.3mm)-0.02'(0.5mm)
Images
Min Trace Width (a)	0.1mm (4 mil)
Min Space Width (b)	0.1mm (4 mil)
Min Annular Ring	0.1mm (4 mil)
SMD Pitch (a)	0.2 mm(8 mil)
BGA Pitch (b)	0.2 mm (8 mil)

Solder Mask
Min Solder Mask Dam (a)	0.0635 mm (2.5mil)
Soldermask Clearance (b)	0.1mm (4 mil)
Min SMT Pad spacing (c)	0.1mm (4 mil)
Solder Mask Thickness	0.0007"(0.018mm)
Holes
Min Hole size (CNC)	0.2 mm (8 mil)
Min Punch Hole Size	0.9 mm (35 mil)
Hole Size Tol (+/-)	PTH:±0.075mm;NPTH: ±0.05mm
Hole Position Tol	±0.075mm
Plating
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel 3-7um Au:1-5u''
OSP	0.2-0.5um
Outline
Panel Outline Tol (+/-)	CNC: ±0.125mm, Punching: ±0.15mm
Beveling	30°45°
Gold Finger angle	15° 30° 45° 60°
Certificate	ROHS, ISO9001:2008, SGS, UL certificate