Shenzhen Tianweisheng Electronic Co., Ltd.
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Price: | 0.02~0.3 USD |
Payment Terms: | T/T,L/C,WU, |
Place of Origin: | Guangdong, China (Mainland) |
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Description | Specification Inch(mm) | |
Material | FR-4,FR1,FR2,CEM-1,CEM-3,94V-0,Aluminum, High TG | |
Layer No. | 1-12 | |
Board thickness | 0.015"(0.4mm)-0.125"(3.2mm) | |
Board Thickness Tolerance | ±10% | |
Cooper thickness | 1/2OZ - 3OZ | |
Impedance Control | ±10% | |
Warpage | 0.75%-1.5% | |
Surface finishing | HASL,OSP,ENIG,Gold plating | |
Images | ||
Min Trace Width (a) | 0.005"(0.125mm) | |
Min Space Width (b) | 0.005"(0.125mm) | |
Min Annular Ring | 0.005"(0.125mm) | |
SMD Pitch (a) | 0.012"(0.3mm) | |
BGA Pitch (b) | 0.027"(0.675mm) | |
Regesiter torlerance | 0.05mm | |
SolderMask | ||
Min Solder Mask Dam (a) | 0.005"(0.125mm) | |
Soldermask Clearance (b) | 0.005"(0.125mm) | |
Min SMT Pad spacing (c) | 0.004"(0.1mm) | |
Solder Mask Thickness | 0.0007"(0.018mm) | |
Holes | ||
Hole size | 0.01"(0.25mm)--0.257"(6.5mm) | |
Hole Size Tol (+/-) | ±0.003"(±0.0762mm) | |
Aspect Ratio | 6:1 | |
Hole Registration | 0.004"(0.1mm) | |
Plating | ||
HASL | 2.5um | |
Lead free HASL | 2.5um | |
Immersion Gold | Nickel3-7umAu:1-3u'' | |
OSP | 0.2-0.5um | |
Outline | ||
Panel Outline Tol (+/-) | ±0.004''(±0.1mm) | |
Beveling | 30°45° | |
V-cut | 15° 30° 45° 60° | |
Certificate | ROHSISO4001:9001SGSULcertificate |