blackberry mobile pcb boards from China manufacturer - Shenzhen Tianweisheng Electronic Co., Ltd.

Price:	0.1~1.0 USD
Payment Terms:	T/T,WU;Paypal
Place of Origin:	Guangdong, China (Mainland)


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Product Detail

Model No.: TWS-H21M

Production Capacity: 120000 Square Meter /Month

Delivery Date: 5-15 working days after you...

Base Material: FR-1,FR-2,FR-4,CEM-1,CEM-3,...

Board Thickness: 0.2mm-7mm

Min. Line Width: 0.075mm(3mil)

Surface Finishing: HALS/HALS lead free,Chemica...

Solder Mask: green/red/blue/white/yellow

Certification: UL/SGS/ROHS

Warp&Twist: 0.7%

Impedance control: ±10%

PCB standard: IPC-A-610D

Means of Transport: Ocean,Land,Air,

Packing: vacuum packaging and carton...

Brand Name: TWS

Copper Thickness: 0.5-4.0oz

Min. Hole Diameter: 0.25mm

Min. Line Spacing: 0.075mm(3mil)

Layer: 1-28 Layer

MAX.Board Size: 9200*900mm

Controlled impedance: ±5%

Rang of finish boards thickness: 0.21~7.0mm

OEM/ODM: One-stop service

blackberry mobile pcb boards
a. PCB&PCBA
b. PCB CLONE
c. TURNKEY
d. blackberry pcb boards
e. ACCEPT THE SMALL ORDER

blackberry mobile pcb boards

Contract Manufacturing

- Engineering Services

- PCB Design & Assembly

- Product Design

- Prototyping

- Cable and Wire Assemblies

- Plastics and Molds

Technical requirement:

1) Professional Surface-mounting and Through-hole soldering Technology

2) Various sizes like 1206,0805,0603 components SMT technology

3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

4) PCB Assembly With UL,CE,FCC,Rohs Approval

5) Nitrogen gas reflow soldering technology for SMT.

6) High Standard SMT&Solder Assembly Line

7) High density interconnected board placement technology capacity.

Quote requirement:

Gerber file of the bare PCB board
BOM (Bill of material) for assembly
To short the lead time, please kindly advise us if there is any acceptable components substitution.
Testing Guide & Test Fixtures if necessary
Programming files & Programming tool if necessary
Schematic if necessary

OEM/ODM/EMS Services for PCBA:

PCBA, PCB assembly: SMT & PTH & BGA
PCBA and enclosure design
Components sourcing and purchasing
Quick prototyping
Plastic injection molding
Metal sheet stamping
Final assembly
Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
Custom clearance for material importing and product exporting

Orientronic PCB assembly Equipment:

SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4
Reflow Oven: FolunGwin FL-RX860
Wave Soldering Machine: FolunGwin ADS300
Automated Optical Inspection (AOI): Aleader ALD-H-350B
Fully Automatic SMT Stencil Printer: FolunGwin Win-5

Capacity of pcb

NO	ITEM	Technical Data
1	Layer	2-20 Layers
2	Board material	FR4,FR4 Halogen free,TEFLON Rogers,Getek High-TG(TG>170),Aluminium base
3	Max.Board Size0	457*660mm
4	Min.Board Thickness	2 layers 0.2mm
		4 layers 0.4mm
		6 layers 0.8mm
		8 layers 1.0mm
		10 layers 1.2mm
5	Max.Board Thickness	8.0mm
6	Min.Line Width	0.05mm
7	Min.Line Space	0.05mm
8	Min.Hole Size0	Electroplating Via 0.15mm
8	Min.Hole Size0	Micro via 0.075mm
9	PTH Wall Thickness)	20-25um
10	Max.finish copper thickness0	8OZ
11	PTH Dia.Tolerance	±0.05mm
12	NPTH Dia.Tolerance	±0.025mm
13	Hole Position Deviation	±0.05mm
14	Outline Tolerance	±0.1mm
15	Min.S/M Pitch	0.08mm
16	Insulation Resistance	3x10Sec, 288°C
17	Warp and Twist	≤0.7%
18	Electric Strength	>1.3KV/mm
19	Peel Strength	≥1.4N/mm
20	Solder Mask Abrasion	≥6H
21	Flammability	94V0
22	Impedance Control	±5%