blank pcb boards manufacturer from China manufacturer - Shenzhen Tianweisheng Electronic Co., Ltd.

Price:	57.0~200.0 USD
Payment Terms:	T/T,L/C,D/A,D/P,WU,
Place of Origin:	Guangdong, China (Mainland)


	Add to My Favorites
HiSupplier Escrow	Share \|

Product Detail

Model No.: mn40

Production Capacity: 1000square meter/per day

Delivery Date: 3~10days

Independence tolerance: +/-10%

Layer count: 1-20

Gold finger: Ni: 80~250u", Au: 1~5u"

Via plug: Max via size: 24mil (0.6mm)

Certification: UL/SGS/ROHS

Means of Transport: Ocean,Land,Air,

Packing: Inner vacuum and plastic pa...

Max pane size: 14"*20"

Aspecr Ratio: 9:1

Solder mask abrasion: ≥8H

Warp and twist: ≤0.75%

Peel Strength: 1.4N/mm

1.Base Material:aluminum for pcb
2.copper thickness:1.5oz
3.board thickness:1.2mm
4.Surface treatment:ENIG
5.layer:1~12

Quick Details

Place of Origin:	Guangdong China (Mainland)	Brand Name:	APC	Model Number:	PCB018
Number of Layers:	4-Layer	Base Material:	FR4	Copper Thickness:	1OZ
Board Thickness:	1.6mm	Min. Hole Size:	0.3mm	Min. Line Width:	0.2mm
Min. Line Spacing:	0.2mm	Surface Finishing:	HASL	SolderMask:	Green
Silkscreen:	White	Testing:	100% Testing before shipment	Samples delivery time:	5days
Mass delivery time:	7-10days	Profilling:	V-cut and Routing	UL certification:	NO.:E248209
Others:	RoHS,ISO9001:2008,SGS(all isthe newest)

Packaging & Delivery

Packaging Detail:	Package: Inner package: Vaccum packing , plastic bag Outer package: standardcarton packing
Delivery Detail:	1-3days

Specifications

Brief description about the 4-layer pcb boards:
1.FR4,4layer pcb,1.6mm,1OZ,HASL
2.17 years experience in PCB,since 1994

Processing Capability Of Rigid PCB
NO.	ITEM	Technique Data
1	Product Range	2 - 24 layers, HDI;Aluminium Based PCBs
2	Base Material	FR-4 Glass Epoxy laminate,ALuminium Based (Others, by special order)
3	Major Laminate	King Board (KB-6150/60), ShengYi(S1141, S1170), Rogers,Teflon
4	Board Thickness	0.1mm-3.5mm
5	Thickness of copper foil for the basis materials	18um(1/2OZ),36um(1OZ),72um(2OZ)
6	The max board size	610*711mm(24"x28")
7	Surface Finish Treatment	Electroless nickel Immersion gold(Electroless Ni/Au),Organic Solderability Preservatives (OSP or Entek), Hot Air Leveling (=HAL-Tin/Lead),<BR>Hot Air Leveling (Lead- Free, RoHS), Carbon Ink, Peelable Mask. Gold Fingers (30µ"), Immersion Silver (3~10u"); Immersion Tin (0.6~1.2um)
8	Via Holes	Copper PTH / Blind Via / Buried Via/ HDI 2+N+2 with IVH
9	Min line width/spacing	0.127mm width/spacing(gild board),0.15mm width/spacing(tin-sprayed board)
10	Min. Board Thickness	0.2mm (2 layers)/0.4mm(4layers)/0.9mm(8 layers)/1.2mm(10 layers)/1.3mm (12 layers)/1.5mm (14 layers)/1.7mm (16 layers) /1.8mm/2.0mm (18 layers)/ 2.2mm (20 layers)/2.4mm( 22 layers)/2.6mm(24 layers)
11	Copper Foil Thickness	18um/35um/70um~245um(outerlayer:0.5oz~7oz)18um/35um/70um~210um(innerlayers:0.5oz~6oz)
12	Coating thickness	1.Gild thickness:0.025um-0.075um 2.Turmeric thickness:0.025um-0.15um 3.Hole wall coating thickness for finished products:18-25um 4.Thickness for hard gold gild the golden finger:0.05um 0.075um 0.100um 0.125um 0.15um
13	Solder resist	1.Categories:sensitization oil includes TaiYo ink PSR-2000,Chuang Yu ink LSM-3000N,and Hongkong XianDa ink ST-500;Thermosel oil include HongKong Xian da ink ST-300,etc 2.Colour:green,white,black,yellow,red and blue.
14	Outline processing categories and tolerance Punch	+/-0.10mm,computer gong:+/-0.15mm,V-CUT:+/-0.2mm,Golden finger faceoff:30°45° 60°