Our PCBmanufacturer are focusing on microware/RF industry, such as power amplifier,tower top amplifier, filter, phase shifter, antenna, base station, GPS and ETC.Our max board size is as large as 2000mmX610mm. We have also equipped PLASMA.The main surface finish includes HASL, gold plating, immersion gold, immersionsilver, immersion tin, OSP and they are all made in house. We have establishedgood relationship with RF material supplier as well, such as ARLON, ROGERS,NELCO, TACONIC, ISOLA
We are also specialized in making bonding PCBs, Min ICis 0.1mm/0.1mm. We can ensure the width and evenness inside bonding area, so asto make sure the excellent bonding characteristic. 1 mil bonding force for goldline can reach ≥ 8g and 1 mil bonding force for aluminium line can reach ≥ 6g.
Meanwhile, we possess other outstanding technical capability as well. Forhigh frequency and impedance board we can control tolerance inside ±5%, and wecan make max copper thickness up to 6 oz.
We are a both seasoned and youngindustrious administration team and well-known of the industry technical trends.Along with the technology progress and clients' requirement, we will increaseinvestment actively so as to make our technology equipment and managementadvanced.

Our factoryability:
We have two central air-conditioners, anti-static and dust-free SMTworkshop, 25 high-speed SMT production lines, (We plan to add 5 to 10SMT lines in this year or next year), and Panasonic chipmounter, which can mount 0201 and BGA/POP, and achieve the mounting speed of1chip/0.039s, BGA minimum separation of 0.25mm, and the daily productioncapacity of 600 million SMT, as well as nitrogen reflow soldering process. It isplanned to introduce 10 SMT high speed production lines in 2013.
We areequipped with 273 comprehensive test instruments such as Agilent 8960, CMU200and MT8820C, and can test the main board of mobile phone in the aspects of AFC,TX, RX power, AGC, PHASE ERROR, main board check, sensitivity, switch spectrum,power (GSM, DCS). It can daily test 150,000 sets.