Shenzhen Tianweisheng Electronic Co., Ltd.
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Gold Index: 77306
Price: | 0.05~1.0 USD |
Payment Terms: | T/T,L/C,WU |
Place of Origin: | Guangdong, China (Mainland) |
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NO | ITEM | Technical capabilities | ||||
1 | Layers | 1-30 layers | ||||
2 | Max. Board size | 2000×610mm | ||||
3 | Min. board Thickness | 2-layer 0.15mm
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4 | Min. line Width/Space | 0.075mm(3mil) | ||||
5 | Max. Copper thickness | 6OZ | ||||
6 | Min. S/M Pitch | 0.075mm(3mil) | ||||
7 | Min. hole size | 0.1mm(4mil) | ||||
8 | Hole dia. Tolerance (PTH) | ±0.05mm(2mil) | ||||
9 | Hole dia. Tolerance (NPTH) | +0/-0.05mm(2mil) | ||||
10 | Hole position deviation | ±0.05mm(2mil) | ||||
11 | Outline tolerance | ±0.10mm(4mil) | ||||
12 | Twist & Bent | 0.75% | ||||
13 | Insulation Resistance | >1012 Ω Normal | ||||
14 | Electric strength | >1.3kv/mm | ||||
15 | S/M abrasion | >6H | ||||
16 | Thermal stress | 288°C 20Sec | ||||
17 | Test Voltage | 50-300V | ||||
18 | Min. blind/buried via | 0.15mm (6mil) | ||||
19 | Surface Finished | HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold | ||||
20 | Materials | FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |
Shenzhen Tianweisheng Electronic Co., Ltd. [China (Mainland)]
Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)