peelable mask pcb peelable mask pcb from China manufacturer - Shenzhen Tianweisheng Electronic Co., Ltd.

Price:	57.0~200.0 USD
Payment Terms:	T/T,L/C,D/A,D/P,WU,
Place of Origin:	Guangdong, China (Mainland)


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Product Detail

Model No.: 415345PN

Production Capacity: 1000square meter/per day

Delivery Date: 3~10days

Independence tolerance: +/-18%

Layer count: 1-24

Gold finger: Ni: 80~250u", Au: 1~5u"

Via plug: Max via size: 24mil (0.6mm)

Certification: UL/SGS/ROHS

Means of Transport: Ocean,Land,Air,

Packing: Inner vacuum and plastic pa...

Max pane size: 34"*25"

Aspecr Ratio: 10:7

Solder mask abrasion: ≥10H

Warp and twist: ≤0.55%

Peel Strength: 1.4N/mm

1.Base Material:Aluminum pcb
2.copper thickness:0.5OZ
3.board thickness:1mm
4.Surface treatment:HASL
5.layer:1~18

Specifications

1.High Quality Peelable Mask PCB
2.Reputablemanufacturer
3.10 years of experience in PCB
4.Quick delivery
5.OEMService

Product: High Quality Peelable Mask PCB

1.Specification:

High quality PCB with gooddesign
10 years of experience inPCB
Reputablemanufacturer
RoHS/ ULCertificated
Competitive price
Quickdelivery

OEMService

2. ProductAttributes:

Technology Project	Productivity &Technology Standards
Certificate	ISO9001,ISO14001,UL
SurfaceFinishing	Plating Nickeland immersion Gold, Hot Air (HASL), HASL Lead Free, OSP, ImmersionTin
Max.panelsize	600mm*700mm
Min.panelsize	5mm*5mm
Board warpage	singleside<=1.0% doubleside<=0.6% multi-layer<=0.6%
Min.Thickness	0.2mm±0.08mm
Min.Linewidth	HASL board0.07mm±20%(2mil±20%)
Min.linespace	immersion Gold0.075mm±20%(2mil±20%)
copperfoil toboard sidespacing	0.5mm
hole sidetolinesidespacing	0.3mm
Min holesize	0.2mm
copperthinckness of Hole	20-35um
Tooling holetolerance	±0.076mm
Min.stampinground hole diameter	FR-4 boardthinckness 1.0mm(40mil)under 1.0mm(40mil)
Min.stampinground hole diameter	FR-4 boardthinckness 1.2-3.0mm(47mil-120mil)1.5mm(59mil)
Min.stampingsquare hole specification	FR-4.CEM-3board thinckness 1.0mm(40mil) under 0.8mm x 0.8mm(31.5mil x31.5mil)
Min.stampingsquare hole specification	FR-4.CEM-3board thinckness 1.2mm - 3.0mm(47mil-120mil) 1.0mm x 1.0mm(40mil x40mil)
trace deviation	±0.076mm(±3mil)
Molding sizetolerancelimit	CNC millingprofile ±0.15mm(±6mil); die profile ±0.15mm(±6mil)
V-CUTregistration accuracy	±0.2mm(±8mil)
product type	single side double side multi-layer and flexible board
BaseMaterial	FR-4,CEM-1,CEM-3, High frequency, aluminium based board
process thinckness	0.2-3.5mm
base material copperthinckness	18um, 35um,70um, 105 um
Min.holddiameter	0.2mm
plating thinckness	plating goldNi2.5-5um, Au0.05-0.10um
plating thinckness	immersion goldNi5-8um, Au0.08-0.12um
plating thinckness	finger goldNi2.5-5um, Au0.05-0.12um
process ability	20000 squaremeters/month
profile process	die CNCmachine
V-CUT horn tolerance	±5°
V-CUT boardmaterialthinckness	0.6mm - 3.2mm (15.5mil -129.58mil)
Min.SMDspace	0.3mm(12mil)
Min.componentmarkingfont	0.15mm(5.79mil)
Min. singleside solder annular width(production)	0.15mm(5.79mil)
Min.cross-hatchingpad	0.076mm(0.3mil)
Min.soldermaskbrigde	±0.076mm(±3mil)
Carboninkboard making data	1)1.0 highimpedance control limit:20K±10%
	2)2.0hardness:6H
	3)3.0 can bearfriction time:over 200000