Shenzhen Tianweisheng Electronic Co., Ltd.
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Gold Index: 77306
Price: | 57.0~200.0 USD |
Payment Terms: | T/T,L/C,D/A,D/P,WU, |
Place of Origin: | Guangdong, China (Mainland) |
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Packaging Detail: | Inner Vaccum Packing Outer Carton Box |
Delivery Detail: | within 7 days |
NO | ITEM | Technical capabilities |
1 | Layers | 2-20 layers |
2 | Max. Board size | 2000×610mm |
3 | Min. board Thickness | 2-layer0.15mm |
4-layer0.38mm | ||
6-layer0.55mm | ||
8-layer0.80mm | ||
10-layer1.0mm | ||
4 | Min. line Width/Space | 0.075mm(3mil) |
5 | Max. Copper thickness | 6OZ |
6 | Min. S/M Pitch | 0.075mm(3mil) |
7 | Min. hole size | 0.1mm(4mil) |
8 | Hole dia. Tolerance (PTH) | ±0.05mm(2mil) |
9 | Hole dia. Tolerance (NPTH) | +0/-0.05mm(2mil) |
10 | Hole position deviation | ±0.05mm(2mil) |
11 | Outline tolerance | ±0.10mm(4mil) |
12 | Twist & Bent | 0.75% |
13 | Insulation Resistance | >1012 Ω Normal |
14 | Electric strength | >1.3kv/mm |
15 | S/M abrasion | >6H |
16 | Thermal stress | 288°C 20Sec |
17 | Test Voltage | 50-300V |
18 | Min. blind/buried via | 0.15mm(6mil) |
19 | Surface Finished | HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
20 | Materials | FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copperbase |
Packaging Detail: | Inner Vaccum Packing Outer Carton Box |
Delivery Detail: | within 7 days |
NO | ITEM | Technical capabilities |
1 | Layers | 2-20 layers |
2 | Max. Board size | 2000×610mm |
3 | Min. board Thickness | 2-layer0.15mm |
4-layer0.38mm | ||
6-layer0.55mm | ||
8-layer0.80mm | ||
10-layer1.0mm | ||
4 | Min. line Width/Space | 0.075mm(3mil) |
5 | Max. Copper thickness | 6OZ |
6 | Min. S/M Pitch | 0.075mm(3mil) |
7 | Min. hole size | 0.1mm(4mil) |
8 | Hole dia. Tolerance (PTH) | ±0.05mm(2mil) |
9 | Hole dia. Tolerance (NPTH) | +0/-0.05mm(2mil) |
10 | Hole position deviation | ±0.05mm(2mil) |
11 | Outline tolerance | ±0.10mm(4mil) |
12 | Twist & Bent | 0.75% |
13 | Insulation Resistance | >1012 Ω Normal |
14 | Electric strength | >1.3kv/mm |
15 | S/M abrasion | >6H |
16 | Thermal stress | 288°C 20Sec |
17 | Test Voltage | 50-300V |
18 | Min. blind/buried via | 0.15mm(6mil) |
19 | Surface Finished | HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
20 | Materials | FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copperbase |
Shenzhen Tianweisheng Electronic Co., Ltd. [China (Mainland)]
Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)