aluminum base copper clad laminate from China manufacturer - Shenzhen Tianweisheng Electronic Co., Ltd.

Price:	0.1~0.5 USD
Payment Terms:	T/T,WU,
Place of Origin:	Guangdong, China (Mainland)


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Product Detail

Means of Transport: Ocean,Land,Air,

Packing: vacuum package+carton box

Number of Layers: 4-Layer

Base Material: fr4

Board Thickness: 1.6mm

Min. Line Width: 0.2mm

Surface finishing: HASL&ENIG

Max size of finish board: 9200*900mm

Controlled impedance: ±5%

Rang of finish boards thickness: 0.21~7.0mm

OEM/ODM: One-stop service

Production Capacity: 300000 Square Meter/Square...

Delivery Date: 10-15 working days for mass...

Brand Name: tws

Copper Thickness: 1oz

Min. Hole Size: 0.15mm

Min. Line Spacing: 0.2mm

Solder mask: Green/Blue/Black/White/Yell...

Certification: UL/SGS/ROHS

Warp&Twist: 0.7%

Layer count: 1~28

PCB standard: IPC-A-610D

aluminum base copper clad laminate
1. wide application ccl
2. LED copper clad laminate
3.made in P.R.C.
4. UL,ROHS,SGS

aluminum base copper clad laminate

Our Advantages:

aluminum base copper clad laminate
10 years factory experience
Provide PCB &PCBA prototype, and medium&low volume quick board services.
One-hour quote response, 24 hours quick-turn produce
Components purchasing, SMT/PCBA one-stop source
ISO 9001,UL RoHs, SGS certificate

One-stop Service:

PCB / FPC/ PCBA Copy
PCB drawing / design according to schematic diagram
PCB manufacturing
Component sourcing
PCB Assembly
PCBA test

Products using range:

Our products are widely used in communication apparatus, automobile electronics, computers, medical devices and network devices and consumer electronics class fields.

Maximum Process PCB board Capability:

Item	Manufacture Capability
Material	FR-4 / Hi Tg FR-4 / Taconic / Rogers / F4BK /CEM-3 / Aluminium / other Metal based
Layer No.	1-20
Finished Board thickness	0.2 mm-3.8mm'(8 mil-150 mil)
Board Thickness Tolerance	±10%
Cooper thickness	0.5 OZ-11OZ (18 um-385 um)
Copper Plating Hole	18-40 um
Impedance Control	±10%
Warp&Twist	0.70%
Peelable	0.012"(0.3mm)-0.02'(0.5mm)
Images
Min Trace Width (a)	0.1mm (4 mil)
Min Space Width (b)	0.1mm (4 mil)
Min Annular Ring	0.1mm (4 mil)
SMD Pitch (a)	0.2 mm(8 mil)
BGA Pitch (b)	0.2 mm (8 mil)
Solder Mask
Min Solder Mask Dam (a)	0.0635 mm (2.5mil)
Soldermask Clearance (b)	0.1mm (4 mil)
Min SMT Pad spacing (c)	0.1mm (4 mil)
Solder Mask Thickness	0.0007"(0.018mm)
Holes
Min Hole size (CNC)	0.2 mm (8 mil)
Min Punch Hole Size	0.9 mm (35 mil)
Hole Size Tol (+/-)	PTH:±0.075mm;NPTH: ±0.05mm
Hole Position Tol	±0.075mm
Plating
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel 3-7um Au:1-5u''
OSP	0.2-0.5um
Outline
Panel Outline Tol (+/-)	CNC: ±0.125mm, Punching: ±0.15mm
Beveling	30°45°
Gold Finger angle	15° 30° 45° 60°
Certificate	ROHS, ISO9001:2008, SGS, UL certificate